ITOH SEIKO CO.,LTD
Please click on [ref] to get the document and the picture.
1. Design and manufacturing precision punching dies. ref. | |||
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| a. For ceramic green sheet | |||
| Dies for trial or mass production | |||
| ・φ0.03 trial puncing die. | |||
| ・φ0.10、 □0.24×0.18 mass production die to punch about 4,000 holes at one time | |||
 0.2*0.25 holes & snaplines |
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| b. For plastic or metal films | |||
| Dies to punch single foil or laminated film | |||
| ･TAB tape for LCD, CSP | |||
| ･PET film, viscous tape, metal foil, paper etc. | |||
 PI φ0.15 |
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2. Design and manufacturing of general parts, precision and fine machining, and press system. | |||
| a-1. Laser drilling processing ref. | |||
| Diameter is down to 30 micrometer. | |||
| ・Round hole, Sheped hole. | |||
| ・Material : tungsten carbide, metal, ceramics, glass etc. | |||
 0.9t φ0.1 Tungsten Carbide |
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| a-2. Laser surface processing ref. | |||
| Please let us know your issue. | |||
| ・Surface micro-processing, coloring. | |||
| ・Material : tungsten carbide, metal, ceramics, glass etc. | |||
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| b. EDM ref. | |||
| Diameter is down to 30 micrometer. | |||
| ・EDM, EDM drilling | |||
| ・Material : tungsten carbide, metal | |||
 φ30μｍ |
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| c. Milling ref. | |||
| Fine milling by high precision and fast macine | |||
| ・Diameter is down to 30 micrometer. | |||
| ・3D milling, diamond bite milling. | |||
| ・Material : metal, machinable ceramic, glass, plactic etc. | |||
 Cone 0.5mm hight |
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| d. Grinding ref. | |||
| V shape, blade etc. | |||
| ・Groove : tungsten carbide, metal, glass etc. | |||
| ・Blade : tungsten carbide, tempered metal. | |||
 50μｍ×1ｍｍ hight |
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| e. Glass ref. | |||
| Quartz glass, pyrex glass etc. | |||
| ・Holes, profile : pyramid, round pole, taper hollow | |||
| ・Groove : micro channel with bonded cover | |||
 70°Ｖ groove 140μｍ depth quartz glass |
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| f. Parts ref. | |||
| Material : tungsten carbide, metal, glass, plactic etc. | |||
| g. Equipment ref. | |||