We have been providing ceramic sheet punching molds for ceramic electronic components for over 50 years.
We contribute to a wide range of fields, from information devices such as smartphones and PCs to heat dissipation substrates for power devices used in power conversion.
Applications
- Packages: Crystal oscillators, optical communication, etc.
- Passive components: Inductors, chip resistors, chip components
- Heat dissipation substrates for power devices
- Piezoelectric components
- White board substrates
Materials
- Alumina
- HTCC (High-Temperature Co-fired Ceramic)
- LTCC (Low-Temperature Co-fired Ceramic)
- ALN (Aluminum Nitride)
- SIN (Silicon Nitride)